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Технічний опис IPC0061-S Chip Quik
Description: DFN-8 STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: DFN, Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Part Status: Active, Thermal Center Pad: 0.057" L x 0.031" W (1.45mm x 0.80mm), Number of Positions: 8.
Інші пропозиції IPC0061-S
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
IPC0061-S | Chip Quik Inc. |
 Description: DFN-8 STENCILPackaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.057" L x 0.031" W (1.45mm x 0.80mm) Number of Positions: 8 |
товару немає в наявності |
В кошику од. на суму грн. |
| IPC0061-S |
|
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.057" L x 0.031" W (1.45mm x 0.80mm)
Number of Positions: 8
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.057" L x 0.031" W (1.45mm x 0.80mm)
Number of Positions: 8
товару немає в наявності
В кошику
од. на суму грн.