IPC0076-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: MSOP-8 STENCIL
Number of Positions: 8
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Part Status: Active
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Type: MSOP
Pitch: 0.026" (0.65mm)
Material: Stainless Steel
Packaging: Bulk
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Технічний опис IPC0076-S Chip Quik Inc.
Description: MSOP-8 STENCIL, Number of Positions: 8, Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm), Part Status: Active, Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Type: MSOP, Pitch: 0.026" (0.65mm), Material: Stainless Steel, Packaging: Bulk.


