IPC0079-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: MSOP-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm)
Number of Positions: 16
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Технічний опис IPC0079-S Chip Quik Inc.
Description: MSOP-16 STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: MSOP, Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Part Status: Active, Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm), Number of Positions: 16.


