IPC0093 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: POWERSSOP-32 TO DIP-36 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
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Технічний опис IPC0093 Chip Quik Inc.
Description: POWERSSOP-32 TO DIP-36 SMT ADAPT, Packaging: Bulk, Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm), Material: FR4 Epoxy Glass, Number of Positions: 32, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: PowerSSO.
