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Технічний опис IPC0171 Chip Quik
Description: BGA-25 TO DIP-25 SMT ADAPTER (1., Packaging: Bulk, Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm), Material: FR4 Epoxy Glass, Number of Positions: 25, Pitch: 0.039" (1.00mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: BGA.
Інші пропозиції IPC0171
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
| IPC0171 | Chip Quik Inc. |
 Description: BGA-25 TO DIP-25 SMT ADAPTER (1.Packaging: Bulk Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm) Material: FR4 Epoxy Glass Number of Positions: 25 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
товару немає в наявності |
В кошику од. на суму грн. |
| IPC0171 |
|
Виробник: Chip Quik Inc.
Description: BGA-25 TO DIP-25 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-25 TO DIP-25 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товару немає в наявності
В кошику
од. на суму грн.