IPC0172-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM
Number of Positions: 8
Thermal Center Pad: 0.169" L x 0.134" W (4.30mm x 3.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.315" L x 0.236" W (8.00mm x 6.00mm)
Type: DFN
Pitch: 0.050" (1.27mm)
Material: Stainless Steel
Packaging: Bulk
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Технічний опис IPC0172-S Chip Quik Inc.
Description: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM, Number of Positions: 8, Thermal Center Pad: 0.169" L x 0.134" W (4.30mm x 3.40mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.315" L x 0.236" W (8.00mm x 6.00mm), Type: DFN, Pitch: 0.050" (1.27mm), Material: Stainless Steel, Packaging: Bulk.
