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Технічний опис IPC0177 Chip Quik
Description: TSSOP-48 (LONG PINS) TO DIP-48 S, Packaging: Bulk, Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm), Material: FR4 Epoxy Glass, Number of Positions: 48, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Part Status: Active.
Інші пропозиції IPC0177
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| IPC0177 | Chip Quik Inc. |
 Description: TSSOP-48 (LONG PINS) TO DIP-48 SPackaging: Bulk Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| IPC0177 |
|
Виробник: Chip Quik Inc.
Description: TSSOP-48 (LONG PINS) TO DIP-48 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-48 (LONG PINS) TO DIP-48 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.