IPC0184-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: POWERPAD-24/POWERSOIC-24 (1.27MM
Pitch: 0.050" (1.27mm)
Material: Stainless Steel
Packaging: Bulk
Number of Positions: 24
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Type: PowerSOIC
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Технічний опис IPC0184-S Chip Quik Inc.
Description: POWERPAD-24/POWERSOIC-24 (1.27MM, Pitch: 0.050" (1.27mm), Material: Stainless Steel, Packaging: Bulk, Number of Positions: 24, Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Type: PowerSOIC.