IPC0258 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: WQFN-14 (510BR) TO DIP-18 SMT AD
Packaging: Bulk
Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
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Технічний опис IPC0258 Chip Quik Inc.
Description: WQFN-14 (510BR) TO DIP-18 SMT AD, Packaging: Bulk, Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm), Material: FR4 Epoxy Glass, Number of Positions: 18, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Part Status: Active.



