KN13C0.7-30DP-0.4V(800) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN 0.4MM SMD HDR 30POS
Number of Rows: 2
Mated Stacking Heights: 0.7mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.022" (0.57mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 30
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Header, Outer Shroud Contacts
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
| Кількість | Ціна |
|---|---|
| 3+ | 109.19 грн |
| 10+ | 80.26 грн |
| 25+ | 72.20 грн |
| 50+ | 62.59 грн |
| 100+ | 57.91 грн |
| 250+ | 52.36 грн |
| 500+ | 47.81 грн |
| 1000+ | 44.46 грн |
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Технічний опис KN13C0.7-30DP-0.4V(800) Hirose Electric Co Ltd
Description: CONN 0.4MM SMD HDR 30POS, Number of Rows: 2, Mated Stacking Heights: 0.7mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.022" (0.57mm), Pitch: 0.016" (0.40mm), Number of Positions: 30, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Header, Outer Shroud Contacts, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції KN13C0.7-30DP-0.4V(800)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
|
KN13C0.7-30DP-0.4V(800) | Виробник : Hirose Electric Co Ltd |
Description: CONN 0.4MM SMD HDR 30POSNumber of Rows: 2 Mated Stacking Heights: 0.7mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.022" (0.57mm) Pitch: 0.016" (0.40mm) Number of Positions: 30 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Header, Outer Shroud Contacts Features: Pick and Place, Solder Retention Packaging: Tape & Reel (TR) |
товару немає в наявності |
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KN13C0.7-30DP-0.4V(800) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors FPC Header 0.4mm 2 point contact |
товару немає в наявності |


