LPAM-50-01.0-L-08-2-K-TR Samtec Inc.
Виробник: Samtec Inc.
Description: .050" LP ARRAY HIGH-SPEED HIGH-D
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Array, Male Pins
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Height Above Board: 0.145" (3.68mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4mm, 4.5mm
Number of Rows: 8
| Кількість | Ціна |
|---|---|
| 300+ | 1479.24 грн |
| 600+ | 1093.93 грн |
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Технічний опис LPAM-50-01.0-L-08-2-K-TR Samtec Inc.
Description: .050" LP ARRAY HIGH-SPEED HIGH-D, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Array, Male Pins, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 400, Pitch: 0.050" (1.27mm), Height Above Board: 0.145" (3.68mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 4mm, 4.5mm, Number of Rows: 8.
Інші пропозиції LPAM-50-01.0-L-08-2-K-TR за ціною від 1256.58 грн до 2470.03 грн
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LPAM-50-01.0-L-08-2-K-TR | Samtec Inc. |
Description: .050" LP ARRAY HIGH-SPEED HIGH-D Features: Board Guide, Pick and Place Packaging: Cut Tape (CT) Connector Type: Array, Male Pins Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 400 Pitch: 0.050" (1.27mm) Height Above Board: 0.145" (3.68mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 4mm, 4.5mm Number of Rows: 8 |
на замовлення 900 шт: термін постачання 21-31 дні (днів) |
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LPAM-50-01.0-L-08-2-K-TR | Samtec |
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array |
на замовлення 503 шт: термін постачання 21-30 дні (днів) |
|
| LPAM-50-01.0-L-08-2-K-TR |
|
Виробник: Samtec Inc.
Description: .050" LP ARRAY HIGH-SPEED HIGH-D
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Array, Male Pins
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Height Above Board: 0.145" (3.68mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4mm, 4.5mm
Number of Rows: 8
Description: .050" LP ARRAY HIGH-SPEED HIGH-D
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Array, Male Pins
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Height Above Board: 0.145" (3.68mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4mm, 4.5mm
Number of Rows: 8
на замовлення 900 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1804.43 грн |
| 10+ | 1476.77 грн |
| 25+ | 1384.24 грн |
| 50+ | 1256.58 грн |
| LPAM-50-01.0-L-08-2-K-TR |
|
Виробник: Samtec
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
на замовлення 503 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 2470.03 грн |
| 10+ | 2327.95 грн |
| 25+ | 1948.89 грн |
| 50+ | 1805.74 грн |
| 100+ | 1550.87 грн |
| 300+ | 1319.74 грн |
| 600+ | 1286.22 грн |