LPC43S30FET100K NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
| Кількість | Ціна |
|---|---|
| 1+ | 669.32 грн |
| 10+ | 505.57 грн |
| 25+ | 470.74 грн |
| 100+ | 405.85 грн |
| 260+ | 398.30 грн |
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Технічний опис LPC43S30FET100K NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 4x10b SAR; D/A 1x10b, Core Processor: ARM® Cortex®-M4/M0, Program Memory Type: ROMless, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 264K x 8, Speed: 204MHz, Mounting Type: Surface Mount, Package / Case: 100-TFBGA, Packaging: Tray, DigiKey Programmable: Not Verified, Number of I/O: 49, Part Status: Active, Supplier Device Package: 100-TFBGA (9x9), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT.