LPC5512JBD64K

LPC5512JBD64K NXP Semiconductors


lpc55s1x_lpc551x_ds.pdf Виробник: NXP Semiconductors
MCU 32-bit ARM Cortex M33 RISC 64KB Flash 3.3V 64-Pin HTQFP EP
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Технічний опис LPC5512JBD64K NXP Semiconductors

Description: IC MCU 32BIT 64KB FLASH 64TQFP, Packaging: Tray, Package / Case: 64-TQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 64KB (64K x 8), RAM Size: 48K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b SAR, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 64-HTQFP (10x10), Number of I/O: 36.

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LPC5512JBD64K LPC5512JBD64K Виробник : NXP Semiconductors lpc55s1x_lpc551x_ds.pdf MCU 32-bit ARM Cortex M33 RISC 64KB Flash 3.3V 64-Pin HTQFP EP
товар відсутній
LPC5512JBD64K Виробник : NXP LPC55S1x_LPC551x.pdf Category: ARM NXP microcontrollers
Description: IC: ARM microcontroller; 64kBFLASH,256kBSRAM; HTQFP64
Type of integrated circuit: ARM microcontroller
Memory: 64kB FLASH; 256kB SRAM
Case: HTQFP64
Supply voltage: 1.8...3.6V DC
Mounting: SMD
Interface: CAN; GPIO; I2C; I2S; SPI; USART; USB
Number of inputs/outputs: 36
Kind of architecture: Cortex M33
Operating temperature: -40...105°C
Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog
кількість в упаковці: 800 шт
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LPC5512JBD64K Виробник : NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
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LPC5512JBD64K LPC5512JBD64K Виробник : NXP Semiconductors LPC55S1x_LPC551x_DS-3139666.pdf ARM Microcontrollers - MCU LPC5512JBD64
товар відсутній
LPC5512JBD64K Виробник : NXP LPC55S1x_LPC551x.pdf Category: ARM NXP microcontrollers
Description: IC: ARM microcontroller; 64kBFLASH,256kBSRAM; HTQFP64
Type of integrated circuit: ARM microcontroller
Memory: 64kB FLASH; 256kB SRAM
Case: HTQFP64
Supply voltage: 1.8...3.6V DC
Mounting: SMD
Interface: CAN; GPIO; I2C; I2S; SPI; USART; USB
Number of inputs/outputs: 36
Kind of architecture: Cortex M33
Operating temperature: -40...105°C
Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog
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