LPC5516JBD100E NXP USA Inc.

Description: IC MCU 32BIT 256KB FLSH 100HLQFP, Packaging: Tray, Package / Case: 100-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 96K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 100-HLQFP (14x14), Part Status: Active, Number of I/O: 64, DigiKey Programmable: Not Verified.