LPC55S28JBD100Y NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Cut Tape (CT)
| Кількість | Ціна |
|---|---|
| 1+ | 556.19 грн |
| 10+ | 415.14 грн |
| 25+ | 384.95 грн |
| 100+ | 330.17 грн |
| 250+ | 315.33 грн |
| 500+ | 306.39 грн |
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Технічний опис LPC55S28JBD100Y NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP, Number of I/O: 64, Supplier Device Package: 100-HLQFP (14x14), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Core Size: 32-Bit, Data Converters: A/D 10x16b, Core Processor: ARM® Cortex®-M33, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 256K x 8, Program Memory Size: 512KB (512K x 8), Speed: 150MHz, Mounting Type: Surface Mount, Package / Case: 100-LQFP Exposed Pad, Packaging: Tape & Reel (TR).
Інші пропозиції LPC55S28JBD100Y
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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LPC55S28JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100HLQFP Number of I/O: 64 Supplier Device Package: 100-HLQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 10x16b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 512KB (512K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. |
 |
LPC55S28JBD100Y | NXP Semiconductors |
ARM Microcontrollers - MCU LPC55S28JBD100 |
товару немає в наявності |
В кошику од. на суму грн. |
| LPC55S28JBD100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| LPC55S28JBD100Y |
|
Виробник: NXP Semiconductors
ARM Microcontrollers - MCU LPC55S28JBD100
ARM Microcontrollers - MCU LPC55S28JBD100
товару немає в наявності
В кошику
од. на суму грн.