Технічний опис LPC55S69JEV59Y NXP Semiconductors
Description: IC, Packaging: Tape & Reel (TR), Package / Case: 59-VFBGA, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 640KB (640K x 8), RAM Size: 320K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33F, Data Converters: A/D 10x16b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT, Supplier Device Package: 59-VFBGA (4x4), Number of I/O: 37.
Інші пропозиції LPC55S69JEV59Y
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
---|---|---|---|---|---|
![]() |
LPC55S69JEV59Y | Виробник : NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 59-VFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 640KB (640K x 8) RAM Size: 320K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT Supplier Device Package: 59-VFBGA (4x4) Number of I/O: 37 |
товару немає в наявності |
|
LPC55S69JEV59Y | Виробник : NXP Semiconductors |
![]() |
товару немає в наявності |