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Технічний опис M40-6002546 Harwin
Description: CONN PLUG 25POS SMD TIN, Features: Board Guide, Solder Retention, Packaging: Tube, Connector Type: Plug, Center Strip Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 25, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 80.0µin (2.03µm), Mated Stacking Heights: 4.3mm, Number of Rows: 2.
Інші пропозиції M40-6002546
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
M40-6002546 | Harwin Inc. |
 Description: CONN PLUG 25POS SMD TINFeatures: Board Guide, Solder Retention Packaging: Tube Connector Type: Plug, Center Strip Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 25 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 80.0µin (2.03µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
товару немає в наявності |
Мінімальне замовлення: 5022 шт В кошику од. на суму грн. |
| M40-6002546 |
|
Виробник: Harwin Inc.
Description: CONN PLUG 25POS SMD TIN
Features: Board Guide, Solder Retention
Packaging: Tube
Connector Type: Plug, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 80.0µin (2.03µm)
Mated Stacking Heights: 4.3mm
Number of Rows: 2
Description: CONN PLUG 25POS SMD TIN
Features: Board Guide, Solder Retention
Packaging: Tube
Connector Type: Plug, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 80.0µin (2.03µm)
Mated Stacking Heights: 4.3mm
Number of Rows: 2
товару немає в наявності
Мінімальне замовлення: 5022 шт
В кошику
од. на суму грн.