MC32PF1550A1EP NXP USA Inc.
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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Технічний опис MC32PF1550A1EP NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS, Packaging: Tray, Package / Case: 40-VFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 3.8V ~ 7V, Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Supplier Device Package: 40-HVQFN (5x5).
Інші пропозиції MC32PF1550A1EP
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
MC32PF1550A1EP | Виробник : NXP Semiconductors |
 Power Management Specialised - PMIC Power Management IC 3 LDO Regs 40 QFN |
товару немає в наявності |