MC32PF1550A1EPR2 NXP USA Inc.
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
на замовлення 4759 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 367.9 грн |
10+ | 318.22 грн |
25+ | 300.88 грн |
100+ | 244.73 грн |
250+ | 232.18 грн |
500+ | 208.33 грн |
1000+ | 172.82 грн |
2500+ | 164.18 грн |
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Технічний опис MC32PF1550A1EPR2 NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS, Packaging: Tape & Reel (TR), Package / Case: 40-VFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 3.8V ~ 7V, Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Supplier Device Package: 40-HVQFN (5x5).
Інші пропозиції MC32PF1550A1EPR2
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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MC32PF1550A1EPR2 | Виробник : NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товар відсутній |
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MC32PF1550A1EPR2 | Виробник : NXP Semiconductors | Power Management Specialised - PMIC Power Management IC 3 LDO Regs 40 QFN |
товар відсутній |