MC33FS6522CAE NXP Semiconductors
Виробник: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 2.2A Vcore LDT CAN, LQFP48EP
| Кількість | Ціна |
|---|---|
| 1+ | 566.12 грн |
| 10+ | 482.01 грн |
| 25+ | 402.26 грн |
| 100+ | 383.98 грн |
| 250+ | 373.43 грн |
| 500+ | 367.10 грн |
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Технічний опис MC33FS6522CAE NXP Semiconductors
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO, Packaging: Tray, Package / Case: 48-LQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 1V ~ 5V, Applications: System Basis Chip, Supplier Device Package: 48-HLQFP (7x7).
Інші пропозиції MC33FS6522CAE
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
MC33FS6522CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. |
| MC33FS6522CAE |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товару немає в наявності
В кошику
од. на суму грн.