MC33FS6522CAER2 NXP USA Inc.
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
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Технічний опис MC33FS6522CAER2 NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO, Packaging: Tape & Reel (TR), Package / Case: 48-LQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 1V ~ 5V, Applications: System Basis Chip, Supplier Device Package: 48-HLQFP (7x7), Part Status: Active.
Інші пропозиції MC33FS6522CAER2
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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MC33FS6522CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. |
|
|
MC33FS6522CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO Packaging: Cut Tape (CT) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. |
 |
MC33FS6522CAER2 | NXP Semiconductors |
Power Management Specialised - PMIC System Basis Chip, DCDC 2.2A Vcore LDT CAN, LQFP48EP |
товару немає в наявності |
В кошику од. на суму грн. |
| MC33FS6522CAER2 |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6522CAER2 |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6522CAER2 |
|
Виробник: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 2.2A Vcore LDT CAN, LQFP48EP
Power Management Specialised - PMIC System Basis Chip, DCDC 2.2A Vcore LDT CAN, LQFP48EP
товару немає в наявності
В кошику
од. на суму грн.