Технічний опис MC33PF8201A0ESR2 NXP Semiconductors
Description: POWER MANAGEMENT IC I.MX8 NON-PR, Packaging: Tape & Reel (TR), Package / Case: 56-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 105°C (TA), Voltage - Supply: 2.5V ~ 5.5V, Applications: High Performance i.MX 8 Processor Based, Supplier Device Package: 56-HVQFN (8x8), Part Status: Active.
Інші пропозиції MC33PF8201A0ESR2
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MC33PF8201A0ESR2 | Виробник : NXP USA Inc. |
 Description: POWER MANAGEMENT IC I.MX8 NON-PRPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8 Processor Based Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
товар відсутній |
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MC33PF8201A0ESR2 | Виробник : NXP Semiconductors |
Power Management Specialised - PMIC Power Management IC, i.MX8, non-prog, 5 buck, 3 LDO, ASIL-B, Auto, QFN 56 |
товар відсутній |