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MFS2613HMDAAAD

MFS2613HMDAAAD NXP USA Inc.

FS26_SDS.pdf Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
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Технічний опис MFS2613HMDAAAD NXP USA Inc.

Description: SAFETY SYSTEM BASIS CHIP WITH LO, Packaging: Tray, Package / Case: 48-LQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 3.2V ~ 36V, Applications: System Basis Chip, Current - Supply: 30µA, Supplier Device Package: 48-LQFP-EP (7x7).