MKE02Z32VLH4R NXP USA Inc.
Виробник: NXP USA Inc.
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
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Технічний опис MKE02Z32VLH4R NXP USA Inc.
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5, Packaging: Tape & Reel (TR), Package / Case: 64-LQFP, Mounting Type: Surface Mount, Speed: 40MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 4K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 256 x 8, Core Processor: ARM® Cortex®-M0+, Data Converters: A/D 16x12b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: I²C, SPI, UART/USART, Peripherals: LVD, PWM, WDT, Supplier Device Package: 64-LQFP (10x10), Number of I/O: 57.