Технічний опис MPF5020CMBA0ESR2 NXP Semiconductors
Description: POWER MANAGEMENT IC, PRE-PROG, 3, Packaging: Tape & Reel (TR), Package / Case: 40-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Applications: High Performance i.MX 8, S32x Processor Based, Supplier Device Package: 40-HVQFN (6x6), Grade: Automotive, Qualification: AEC-Q100.
Інші пропозиції MPF5020CMBA0ESR2
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| MPF5020CMBA0ESR2 | Виробник : NXP USA Inc. |
 Description: POWER MANAGEMENT IC, PRE-PROG, 3Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
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| MPF5020CMBA0ESR2 | Виробник : NXP Semiconductors |
Power Management Specialised - PMIC Power Management IC, pre-prog, 3 step-down DC/DC, 1 LDO, ASIL-B Safety Level |
товару немає в наявності |