MPF5032BMMA0ESR2 NXP USA Inc.
Виробник: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Відгуки про товар
Написати відгук
Технічний опис MPF5032BMMA0ESR2 NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE, Packaging: Tape & Reel (TR), Package / Case: 40-PowerVFQFN, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 3.3V ~ 5.25V, Applications: System Basis Chip, Supplier Device Package: 40-HVQFN (6x6), Grade: Automotive, Qualification: AEC-Q100.
Інші пропозиції MPF5032BMMA0ESR2
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
MPF5032BMMA0ESR2 | Виробник : NXP Semiconductors |
 Power Management Specialised - PMIC Power management IC, S32, non-prog, 2 buck, 2 LDO, Auto, ASIL D, grade 1, QFN 40 |
товару немає в наявності |