MSCDC200A70D1PAG Microchip Technology
Виробник: Microchip TechnologyDescription: PM-DIODE-SIC-SBD-D1P
Packaging: Box
Package / Case: Module
Mounting Type: Chassis Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 200A
Supplier Device Package: D1P
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 700 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 200 A
Current - Reverse Leakage @ Vr: 800 µA @ 700 V
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 13040.96 грн |
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Технічний опис MSCDC200A70D1PAG Microchip Technology
Description: PM-DIODE-SIC-SBD-D1P, Packaging: Box, Package / Case: Module, Mounting Type: Chassis Mount, Speed: No Recovery Time > 500mA (Io), Reverse Recovery Time (trr): 0 ns, Technology: SiC (Silicon Carbide) Schottky, Diode Configuration: 1 Pair Series Connection, Current - Average Rectified (Io) (per Diode): 200A, Supplier Device Package: D1P, Operating Temperature - Junction: -40°C ~ 175°C, Part Status: Active, Voltage - DC Reverse (Vr) (Max): 700 V, Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 200 A, Current - Reverse Leakage @ Vr: 800 µA @ 700 V.
Інші пропозиції MSCDC200A70D1PAG
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| MSCDC200A70D1PAG | Виробник : MICROCHIP (MICROSEMI) |
Category: Diode modules Description: Module: diode; double series; 700V; 200A; D1P; screw; screw; SiC Case: D1P Electrical mounting: screw Mechanical mounting: screw Type of module: diode Features of semiconductor devices: Schottky Technology: SiC Max. off-state voltage: 700V Load current: 200A Semiconductor structure: double series кількість в упаковці: 1 шт |
товар відсутній |
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| MSCDC200A70D1PAG | Виробник : MICROCHIP (MICROSEMI) |
Category: Diode modules Description: Module: diode; double series; 700V; 200A; D1P; screw; screw; SiC Case: D1P Electrical mounting: screw Mechanical mounting: screw Type of module: diode Features of semiconductor devices: Schottky Technology: SiC Max. off-state voltage: 700V Load current: 200A Semiconductor structure: double series |
товар відсутній |