MT29F256G08EBHAFB16A3WC1ES Micron Technology Inc.
Виробник: Micron Technology Inc.
Description: IC FLASH 256GBIT PARALLEL DIE
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
DigiKey Programmable: Not Verified
Memory Organization: 32G x 8
Memory Interface: Parallel
Part Status: Obsolete
Supplier Device Package: Die
Memory Format: FLASH
Clock Frequency: 333 MHz
Technology: FLASH - NAND (TLC)
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Gbit
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Технічний опис MT29F256G08EBHAFB16A3WC1ES Micron Technology Inc.
Description: IC FLASH 256GBIT PARALLEL DIE, Mounting Type: Surface Mount, Package / Case: Die, Packaging: Bulk, DigiKey Programmable: Not Verified, Memory Organization: 32G x 8, Memory Interface: Parallel, Part Status: Obsolete, Supplier Device Package: Die, Memory Format: FLASH, Clock Frequency: 333 MHz, Technology: FLASH - NAND (TLC), Voltage - Supply: 2.5V ~ 3.6V, Operating Temperature: 0°C ~ 70°C (TA), Memory Type: Non-Volatile, Memory Size: 256Gbit.