Технічний опис NC2SW.015 1LB Chip Quik
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60, Packaging: Bulk, Diameter: 0.015" (0.38mm), Composition: Sn60Pb40 (60/40), Type: Wire Solder, Melting Point: 361°F ~ 370°F (183°C ~ 188°C), Form: Spool, 1 lb (453.592g), Process: Leaded, Flux Type: No-Clean, Part Status: Active.
Інші пропозиції NC2SW.015 1LB
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
NC2SW.015 1LB | Chip Quik Inc. |
 Description: SOLDER WIRE 60/40 TIN/LEAD (SN60Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361°F ~ 370°F (183°C ~ 188°C) Form: Spool, 1 lb (453.592g) Process: Leaded Flux Type: No-Clean Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| NC2SW.015 1LB |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 lb (453.592g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 lb (453.592g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.