Технічний опис NX3DV42GU33Z NXP Semiconductors
Description: NX3DV42GU33, Packaging: Tape & Reel (TR), Features: Break-Before-Make, USB 2.0, Package / Case: 10-XFQFN, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TA), Applications: USB, On-State Resistance (Max): 6.5Ohm, -3db Bandwidth: 950MHz, Supplier Device Package: 10-XQFN (1.4x1.8), Voltage - Supply, Single (V+): 3V ~ 4.3V, Switch Circuit: DPDT, Multiplexer/Demultiplexer Circuit: 2:1, Number of Channels: 1, Grade: Automotive, Qualification: AEC-Q100.
Інші пропозиції NX3DV42GU33Z
Фото | Назва | Виробник | Інформація |
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NX3DV42GU33Z | Виробник : NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Break-Before-Make, USB 2.0 Package / Case: 10-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: USB On-State Resistance (Max): 6.5Ohm -3db Bandwidth: 950MHz Supplier Device Package: 10-XQFN (1.4x1.8) Voltage - Supply, Single (V+): 3V ~ 4.3V Switch Circuit: DPDT Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 1 Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
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NX3DV42GU33Z | Виробник : NXP Semiconductors |
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товару немає в наявності |