Технічний опис OM13493UL NXP Semiconductors
Description: SURFACE MOUNT TO DIP EVALUATION, Packaging: Bulk, Number of Positions: 14, 16, 20, 24, Quantity: 24 Pieces (4 Values - 6 Each), Kit Type: Adapter, Breakout Boards, Specifications: SMD to DIP, Package Accepted: DHVQFN.
Інші пропозиції OM13493UL
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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OM13493UL | NXP USA Inc. |
 Description: SURFACE MOUNT TO DIP EVALUATIONPackaging: Bulk Number of Positions: 14, 16, 20, 24 Quantity: 24 Pieces (4 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: DHVQFN |
товару немає в наявності |
В кошику од. на суму грн. |
| OM13493UL |
|
Виробник: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: DHVQFN
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: DHVQFN
товару немає в наявності
В кошику
од. на суму грн.