PA0002C Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Packaging: Bulk
Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
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Технічний опис PA0002C Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2, Packaging: Bulk, Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC, Part Status: Active.



