PA0034C Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: TSSOP-16 TO DIP-16 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
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Технічний опис PA0034C Chip Quik Inc.
Description: TSSOP-16 TO DIP-16 SMT ADAPTER (, Packaging: Bulk, Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 16, Pitch: 0.026" (0.65mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Part Status: Active.



