Відгуки про товар
Написати відгук
Технічний опис PA0038 Chip Quik
Description: TSSOP-30 TO DIP-30 SMT ADAPTER, Packaging: Bulk, Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm), Material: FR4 Epoxy Glass, Number of Positions: 30, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Part Status: Active.
Інші пропозиції PA0038
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
PA0038 | Chip Quik Inc. |
 Description: TSSOP-30 TO DIP-30 SMT ADAPTERPackaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| PA0038 |
|
Виробник: Chip Quik Inc.
Description: TSSOP-30 TO DIP-30 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-30 TO DIP-30 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.