PA0064 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: QFN-24-THIN TO DIP-24 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN THIN
Part Status: Active
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Технічний опис PA0064 Chip Quik Inc.
Description: QFN-24-THIN TO DIP-24 SMT ADAPTE, Packaging: Bulk, Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm), Material: FR4 Epoxy Glass, Number of Positions: 24, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: QFN THIN, Part Status: Active.


