PA0089C Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
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Технічний опис PA0089C Chip Quik Inc.
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP, Packaging: Bulk, Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.026" (0.65mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOT-23, Part Status: Active.



