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Технічний опис PA0107 Chip Quik
Description: PLCC-44/LCC-44/JLCC-44 TO DIP-44, Packaging: Bulk, Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm), Material: FR4 Epoxy Glass, Number of Positions: 44, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: LCC, JLCC, PLCC, Part Status: Active.
Інші пропозиції PA0107
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
PA0107 | Chip Quik Inc. |
 Description: PLCC-44/LCC-44/JLCC-44 TO DIP-44Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| PA0107 |
|
Виробник: Chip Quik Inc.
Description: PLCC-44/LCC-44/JLCC-44 TO DIP-44
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44/LCC-44/JLCC-44 TO DIP-44
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.