PA0113 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: TQFP-64/QFP-64 TO DIP-64 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PQFP, TQFP
Part Status: Active
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Технічний опис PA0113 Chip Quik Inc.
Description: TQFP-64/QFP-64 TO DIP-64 SMT, Packaging: Bulk, Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm), Material: FR4 Epoxy Glass, Number of Positions: 64, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: PQFP, TQFP, Part Status: Active.


