PA0153 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: MICROSMD-5 BGA-5 0.5 MM PITCH
Part Status: Active
Package Accepted: MicroSMD, BGA
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.020" (0.50mm)
Number of Positions: 5
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Packaging: Bulk
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Технічний опис PA0153 Chip Quik Inc.
Description: MICROSMD-5 BGA-5 0.5 MM PITCH, Part Status: Active, Package Accepted: MicroSMD, BGA, Proto Board Type: SMD to DIP, Board Thickness: 0.062" (1.57mm) 1/16", Pitch: 0.020" (0.50mm), Number of Positions: 5, Material: FR4 Epoxy Glass, Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm), Packaging: Bulk.
