PA0171-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: MINI SOIC-10 STENCIL
Number of Positions: 10
Thermal Center Pad: 0.315" L x 0.067" W (8.00mm x 1.70mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Type: Mini SOIC
Pitch: 0.020" (0.50mm)
Material: Stainless Steel
Packaging: Bulk
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Технічний опис PA0171-S Chip Quik Inc.
Description: MINI SOIC-10 STENCIL, Number of Positions: 10, Thermal Center Pad: 0.315" L x 0.067" W (8.00mm x 1.70mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Type: Mini SOIC, Pitch: 0.020" (0.50mm), Material: Stainless Steel, Packaging: Bulk.
