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Технічний опис PA0186 Chip Quik
Description: TO-263-7 DDPAK/D2PAK TO DIP-14, Packaging: Bulk, Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 7, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: TO-263 (DDPAK/D2PAK), Part Status: Active.
Інші пропозиції PA0186
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
PA0186 | Chip Quik Inc. |
 Description: TO-263-7 DDPAK/D2PAK TO DIP-14Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 7 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TO-263 (DDPAK/D2PAK) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
PA0186 | LOGILINK |
Category: Mains connectors Description: Transition: adapter; 2P; white; PIN: 2 Colour: white Connector pinout layout: 2P Type of transition: adapter Number of pins: 2 |
товару немає в наявності |
В кошику од. на суму грн. |
| PA0186 |
|
Виробник: Chip Quik Inc.
Description: TO-263-7 DDPAK/D2PAK TO DIP-14
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
Description: TO-263-7 DDPAK/D2PAK TO DIP-14
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.