PA0191 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
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Технічний опис PA0191 Chip Quik Inc.
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT, Packaging: Bulk, Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm), Material: FR4 Epoxy Glass, Number of Positions: 10, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: TSSOP.



