PA0195C Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT A
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
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Технічний опис PA0195C Chip Quik Inc.
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT A, Packaging: Bulk, Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm), Number of Positions: 28, Pitch: 0.026" (0.65mm), Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Part Status: Active.



