Відгуки про товар
Написати відгук
Технічний опис PA0206 Chip Quik
Description: DFN-16-EXP-PAD TO DIP-20 SMT, Packaging: Bulk, Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm), Material: FR4 Epoxy Glass, Number of Positions: 16, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: DFN, Part Status: Active.
Інші пропозиції PA0206
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
PA0206 | Chip Quik Inc. |
 Description: DFN-16-EXP-PAD TO DIP-20 SMTPackaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| PA0206 |
|
Виробник: Chip Quik Inc.
Description: DFN-16-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-16-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.