Технічний опис QFS-016-04.25-H-D-DP-A-P Samtec
Description: CONN DIFF ARRAY RCP 32P SMD GOLD, Packaging: Tray, Features: Board Guide, Ground Bus (Plane), Pick and Place, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 32, Pitch: 0.025" (0.64mm), Height Above Board: 0.278" (7.06mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 10mm, 11mm, 14mm, Number of Rows: 2.
Інші пропозиції QFS-016-04.25-H-D-DP-A-P
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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QFS-016-04.25-H-D-DP-A-P | Виробник : Samtec Inc. |
Description: CONN DIFF ARRAY RCP 32P SMD GOLD Packaging: Tray Features: Board Guide, Ground Bus (Plane), Pick and Place Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 32 Pitch: 0.025" (0.64mm) Height Above Board: 0.278" (7.06mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 10mm, 11mm, 14mm Number of Rows: 2 |
товару немає в наявності |
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QFS-016-04.25-H-D-DP-A-P | Виробник : Samtec |
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товару немає в наявності |