QFS-032-04.25-L-D-DP-A-GP Samtec Inc.
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 10mm, 11mm, 14mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.278" (7.06mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 64
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Female
Features: Board Guide, Ground Bus (Plane), Mating Guide
Packaging: Tray
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Технічний опис QFS-032-04.25-L-D-DP-A-GP Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 10mm, 11mm, 14mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.278" (7.06mm), Pitch: 0.025" (0.64mm), Number of Positions: 64, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Female, Features: Board Guide, Ground Bus (Plane), Mating Guide, Packaging: Tray.
Інші пропозиції QFS-032-04.25-L-D-DP-A-GP
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
|
QFS-032-04.25-L-D-DP-A-GP | Samtec |
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip |
товару немає в наявності |
В кошику од. на суму грн. |
| QFS-032-04.25-L-D-DP-A-GP |
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Виробник: Samtec
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip
товару немає в наявності
В кошику
од. на суму грн.



