QFS-048-04.25-L-D-DP-RF1 Samtec Inc.
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY RCP 96P SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 10mm, 11mm, 14mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.293" (7.45mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 98 (96 + 2 RF Jacks)
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Female
Features: Board Guide, Ground Bus (Plane), RF Jacks (2)
Packaging: Tray
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Технічний опис QFS-048-04.25-L-D-DP-RF1 Samtec Inc.
Description: CONN DIFF ARRAY RCP 96P SMD GOLD, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 10mm, 11mm, 14mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.293" (7.45mm), Pitch: 0.025" (0.64mm), Number of Positions: 98 (96 + 2 RF Jacks), Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Female, Features: Board Guide, Ground Bus (Plane), RF Jacks (2), Packaging: Tray.
Інші пропозиції QFS-048-04.25-L-D-DP-RF1
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
QFS-048-04.25-L-D-DP-RF1 | Samtec |
 Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. |
| QFS-048-04.25-L-D-DP-RF1 |
|
Виробник: Samtec
Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip
Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.