Продукція > SAMTEC INC. > QFSS-032-04.25-L-D-DP-PC4
QFSS-032-04.25-L-D-DP-PC4

QFSS-032-04.25-L-D-DP-PC4 Samtec Inc.

qfxx-xxx-xx.xx-x-d-x-xxx-footprint.pdf Виробник: Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Packaging: Tray
Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 72 (64 + 8 Power)
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 11mm
Number of Rows: 2
на замовлення 506 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1373.58 грн
10+ 1145.86 грн
25+ 1086.01 грн
40+ 1004.4 грн
80+ 886.24 грн
230+ 827.16 грн
440+ 796.17 грн
Відгуки про товар
Написати відгук

Технічний опис QFSS-032-04.25-L-D-DP-PC4 Samtec Inc.

Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Packaging: Tray, Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 72 (64 + 8 Power), Pitch: 0.025" (0.64mm), Height Above Board: 0.278" (7.06mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 11mm, Number of Rows: 2.