Технічний опис QMS-016-01-SL-D-DP-RA-MG Samtec
Description: CONN DIFF ARRAY PLG 32P R/A GOLD, Number of Rows: 2, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.320" (8.12mm), Pitch: 0.025" (0.64mm), Number of Positions: 32, Mounting Type: Surface Mount, Right Angle; Through Hole, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Features: Ground Bus (Plane), Mating Guide, Packaging: Tray.
Інші пропозиції QMS-016-01-SL-D-DP-RA-MG
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| QMS-016-01-SL-D-DP-RA-MG | Samtec Inc. |
Description: CONN DIFF ARRAY PLG 32P R/A GOLDNumber of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Height Above Board: 0.320" (8.12mm) Pitch: 0.025" (0.64mm) Number of Positions: 32 Mounting Type: Surface Mount, Right Angle; Through Hole Contact Finish: Gold Connector Type: Differential Pair Array, Male Features: Ground Bus (Plane), Mating Guide Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. |
| QMS-016-01-SL-D-DP-RA-MG |
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Виробник: Samtec Inc.
Description: CONN DIFF ARRAY PLG 32P R/A GOLD
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.320" (8.12mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 32
Mounting Type: Surface Mount, Right Angle; Through Hole
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Ground Bus (Plane), Mating Guide
Packaging: Tray
Description: CONN DIFF ARRAY PLG 32P R/A GOLD
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.320" (8.12mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 32
Mounting Type: Surface Mount, Right Angle; Through Hole
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Ground Bus (Plane), Mating Guide
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.



