QMS-016-06.75-L-D-DP-A Samtec Inc.
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY PLG 32P SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 11mm, 13mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.250" (6.35mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 32
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Board Guide, Ground Bus (Plane)
Packaging: Tray
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Технічний опис QMS-016-06.75-L-D-DP-A Samtec Inc.
Description: CONN DIFF ARRAY PLG 32P SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 11mm, 13mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.250" (6.35mm), Pitch: 0.025" (0.64mm), Number of Positions: 32, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Features: Board Guide, Ground Bus (Plane), Packaging: Tray.
Інші пропозиції QMS-016-06.75-L-D-DP-A
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
|
QMS-016-06.75-L-D-DP-A | Samtec |
Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip |
товару немає в наявності |
В кошику од. на суму грн. |
| QMS-016-06.75-L-D-DP-A |
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Виробник: Samtec
Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip
Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip
товару немає в наявності
В кошику
од. на суму грн.



